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Copper plating uniformity on resistive substrate with segmented anode

dc.contributor.authorYang, Liu
dc.contributor.authorRadisic, Alex
dc.contributor.authorDeconinck, Johan
dc.contributor.authorVereecken, Philippe
dc.date.accessioned2021-10-21T14:51:30Z
dc.date.available2021-10-21T14:51:30Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23420
dc.sourceIIOimport
dc.titleCopper plating uniformity on resistive substrate with segmented anode
dc.typeMeeting abstract
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.source.peerreviewyes
dc.source.beginpage2089
dc.source.conference224th ECS Fall Meeting
dc.source.conferencedate27/10/2013
dc.source.conferencelocationSan Francisco, CA USA
dc.identifier.urlhttp://ma.ecsdl.org/content/MA2013-02/29/2089.full.pdf+html?sid=781ab3e7-1851-4125-acf5-40063ad86411
imec.availabilityPublished - imec
imec.internalnotesECS Meeting Abstracts; Vol. MA2013-02


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