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2D vs 3D integration: Architecture-technology co-design for future mobile MPSoC platforms

dc.contributor.authorAgrawal, Prashant
dc.contributor.authorMilojevic, Dragomir
dc.contributor.authorRaghavan, Praveen
dc.contributor.authorCatthoor, Francky
dc.contributor.authorVan der Perre, Liesbet
dc.contributor.authorBeyne, Eric
dc.contributor.authorVaradarajan, Ravi
dc.date.accessioned2021-10-22T00:43:16Z
dc.date.available2021-10-22T00:43:16Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23478
dc.sourceIIOimport
dc.title2D vs 3D integration: Architecture-technology co-design for future mobile MPSoC platforms
dc.typeProceedings paper
dc.contributor.imecauthorAgrawal, Prashant
dc.contributor.imecauthorMilojevic, Dragomir
dc.contributor.imecauthorCatthoor, Francky
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecCatthoor, Francky::0000-0002-3599-8515
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage381
dc.source.endpage384
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate20/05/2014
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6831839&queryText%3D2D+vs+3D+integration%3A+Architecture-technolo
imec.availabilityPublished - open access


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