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Measurements and analysis of substrate noise coupling in TSV based 3D integrated circuits

dc.contributor.authorAraga, Yuuki
dc.contributor.authorNagata, Makoto
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorMarchal, Pol
dc.contributor.authorLibois, Michael
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorZhang, Wenqi
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T00:43:49Z
dc.date.available2021-10-22T00:43:49Z
dc.date.issued2014-06
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23497
dc.sourceIIOimport
dc.titleMeasurements and analysis of substrate noise coupling in TSV based 3D integrated circuits
dc.typeJournal article
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorLibois, Michael
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1026
dc.source.endpage1037
dc.source.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.issue6
dc.source.volume4
dc.identifier.urlhttp://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=06807746
imec.availabilityPublished - imec


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