Measurements and analysis of substrate noise coupling in TSV based 3D integrated circuits

Metadata

Show full item record

Authors

Araga, Yuuki; Nagata, Makoto; Van der Plas, Geert; Marchal, Pol; Libois, Michael; La Manna, Antonio; Zhang, Wenqi; Beyer, Gerald; Beyne, Eric

ISSN

2156-3950

Issue

6

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volume

4

Title

Measurements and analysis of substrate noise coupling in TSV based 3D integrated circuits

Publication type

Journal article

Collections

Articles