Publication:

Measurements and analysis of substrate noise coupling in TSV based 3D integrated circuits

Date

2014-06
Journal article
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Author(s)

Araga, Yuuki
;
Nagata, Makoto
;
Van der Plas, Geert  
;
Marchal, Pol
;
Libois, Michael  
;
La Manna, Antonio  
;
Zhang, Wenqi
;
Beyer, Gerald  
;
Beyne, Eric  

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

Abstract

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1988 since deposited on 2021-10-22
Acq. date: 2026-02-28

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1988 since deposited on 2021-10-22
Acq. date: 2026-02-28

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