Publication:

Measurements and analysis of substrate noise coupling in TSV based 3D integrated circuits

Date

2014-06
Journal article
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dc.contributor.authorAraga, Yuuki
dc.contributor.authorNagata, Makoto
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorMarchal, Pol
dc.contributor.authorLibois, Michael
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorZhang, Wenqi
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorLibois, Michael
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T00:43:49Z
dc.date.available2021-10-22T00:43:49Z
dc.date.issued2014-06
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23497
dc.identifier.urlhttp://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=06807746
dc.source.beginpage1026
dc.source.endpage1037
dc.source.issue6
dc.source.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.volume4
dc.title

Measurements and analysis of substrate noise coupling in TSV based 3D integrated circuits

dc.typeJournal article
dspace.entity.typePublication
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