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Advancements in thermal-fluid engineering and its application to electronics cooling system design

dc.contributor.authorBaelmans, Martine
dc.contributor.authorBuckinx, Geert
dc.contributor.authorGielen, Ruben
dc.contributor.authorMaggioni, Federica
dc.contributor.authorSaenen, Tom
dc.contributor.authorVan Oevelen, Tijs
dc.date.accessioned2021-10-22T00:44:15Z
dc.date.available2021-10-22T00:44:15Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23507
dc.sourceIIOimport
dc.titleAdvancements in thermal-fluid engineering and its application to electronics cooling system design
dc.typeOral presentation
dc.source.peerreviewno
dc.source.conferenceIEEE Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE
dc.source.conferencedate7/04/2014
dc.source.conferencelocationGent Belgium
imec.availabilityPublished - imec


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