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Low damage cryogenic etching of low-k materials for advanced interconnects

dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorZhang, Liping
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorDussart, Remi
dc.contributor.authorGoodyear, Andy
dc.date.accessioned2021-10-22T00:44:44Z
dc.date.available2021-10-22T00:44:44Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23517
dc.sourceIIOimport
dc.titleLow damage cryogenic etching of low-k materials for advanced interconnects
dc.typeMeeting abstract
dc.contributor.imecauthorZhang, Liping
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.source.peerreviewno
dc.source.beginpage59
dc.source.endpage60
dc.source.conference23rd Conference on Materials for Advanced Metallization - MAM
dc.source.conferencedate2/03/2014
dc.source.conferencelocationChemnitz Germany
imec.availabilityPublished - imec


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