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Electrically conductive adhesives: a real alternative to soldered intercommention?

dc.contributor.authorBeaucarne, Guy
dc.contributor.authorCampeol, Frederic
dc.contributor.authorYoung, Xue
dc.contributor.authorWei, Jason
dc.contributor.authorYu, Yanghai
dc.contributor.authorKuzma Filipek, Izabela
dc.contributor.authorRussell, Richard
dc.contributor.authorDuerinckx, Filip
dc.date.accessioned2021-10-22T00:45:12Z
dc.date.available2021-10-22T00:45:12Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23525
dc.sourceIIOimport
dc.titleElectrically conductive adhesives: a real alternative to soldered intercommention?
dc.typeOral presentation
dc.contributor.imecauthorKuzma Filipek, Izabela
dc.contributor.imecauthorDuerinckx, Filip
dc.contributor.orcidimecDuerinckx, Filip::0000-0003-2570-7371
dc.source.peerreviewno
dc.source.conference29th European Photovoltaic Solar Energy Conference and Exhibition - EUPVSEC
dc.source.conferencedate21/09/2014
dc.source.conferencelocationAmsterdam The Netherlands
imec.availabilityPublished - imec


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