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Ribbon bonding on busbarless cells using Electrically Conductive Adhesives: potential and challenges

dc.contributor.authorBeaucarne, Guy
dc.contributor.authorKuzma Filipek, Izabela
dc.contributor.authorCampeol, Frederic
dc.contributor.authorRussell, Richard
dc.contributor.authorYoung, Xue Yang
dc.contributor.authorWei, Jason
dc.contributor.authorYu, Yanghai
dc.contributor.authorDuerinckx, Filip
dc.date.accessioned2021-10-22T00:45:16Z
dc.date.available2021-10-22T00:45:16Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23526
dc.sourceIIOimport
dc.titleRibbon bonding on busbarless cells using Electrically Conductive Adhesives: potential and challenges
dc.typeMeeting abstract
dc.contributor.imecauthorKuzma Filipek, Izabela
dc.contributor.imecauthorDuerinckx, Filip
dc.contributor.orcidimecDuerinckx, Filip::0000-0003-2570-7371
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conference5th Workshop on Metallization of Crystalline Silicon Solar Cells
dc.source.conferencedate20/10/2014
dc.source.conferencelocationKonstanz Germany
imec.availabilityPublished - open access


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