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3D system integration - mitigating the impact on CMOS devices

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T00:46:14Z
dc.date.available2021-10-22T00:46:14Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23541
dc.sourceIIOimport
dc.title3D system integration - mitigating the impact on CMOS devices
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceInternational Solid State Circuit Conference - ISSCC: Tutorial F2 "3D Stacking Technologies for Image Sensors and Memories"
dc.source.conferencedate9/02/2014
dc.source.conferencelocationSan Francisco USA
imec.availabilityPublished - imec


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