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3D interposer technology - challenges and opportunities

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T00:46:27Z
dc.date.available2021-10-22T00:46:27Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23545
dc.sourceIIOimport
dc.title3D interposer technology - challenges and opportunities
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conference3D TSV Integration workshop, Semiconductor Society IEIE and IEEE-CAS, Kyung Hee University
dc.source.conferencedate25/09/2014
dc.source.conferencelocationSuwon Korea
imec.availabilityPublished - imec


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