Low-cost post-bond testing of 3D-ICs containing a passive silicon interposer base

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Authors

Chi, Chun-Chuan; Marinissen, Erik Jan; Goel, Sandeep Kumar; Wu, Cheng-Wen

ISSN

1063-8210

Issue

11

Journal

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Volume

22

Title

Low-cost post-bond testing of 3D-ICs containing a passive silicon interposer base

Publication type

Journal article

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