Show simple item record

Effect of line-overlay and via-misalignment on dielectric reliability for different patterning schemes

dc.contributor.authorCroes, Kristof
dc.contributor.authorCiofi, Ivan
dc.contributor.authorKocaay, Deniz
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBoemmels, Juergen
dc.date.accessioned2021-10-22T01:03:57Z
dc.date.available2021-10-22T01:03:57Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23691
dc.sourceIIOimport
dc.titleEffect of line-overlay and via-misalignment on dielectric reliability for different patterning schemes
dc.typeProceedings paper
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceIEEE International Reliability Physics Symposium - IRPS
dc.source.conferencedate1/06/2014
dc.source.conferencelocationWaikoloa, HI USA
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6861118&contentType=Conference+Publications
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
28726.pdf
Size:
330.7Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record