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Correlation between Cu microstructure and TSV Cu pumping

dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorVan der Donck, Tom
dc.contributor.authorCroes, Kristof
dc.date.accessioned2021-10-22T01:07:07Z
dc.date.available2021-10-22T01:07:07Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23710
dc.sourceIIOimport
dc.titleCorrelation between Cu microstructure and TSV Cu pumping
dc.typeProceedings paper
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewyes
dc.source.beginpage613
dc.source.endpage619
dc.source.conferenceIEEE Electronic Components and Technology Conference
dc.source.conferencedate27/05/2014
dc.source.conferencelocationLake Buena Vista USA
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6897349&contentType=Conference+Publications
imec.availabilityPublished - imec


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