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Failure analysis challenges for 3D stacked ICs

dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorWang, Teng
dc.contributor.authorLinten, Dimitri
dc.contributor.authorGuerrieri, Stefano
dc.date.accessioned2021-10-22T01:11:19Z
dc.date.available2021-10-22T01:11:19Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23735
dc.sourceIIOimport
dc.titleFailure analysis challenges for 3D stacked ICs
dc.typeMeeting abstract
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorLinten, Dimitri
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecLinten, Dimitri::0000-0001-8434-1838
dc.source.peerreviewno
dc.source.conferenceInternational ESD Workshop - IEW
dc.source.conferencedate19/05/2014
dc.source.conferencelocationGrenoble France
imec.availabilityPublished - imec


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