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Contact module at dense gate pitch technology challenges

dc.contributor.authorDemuynck, Steven
dc.contributor.authorMao, Ming
dc.contributor.authorKunnen, Eddy
dc.contributor.authorVersluijs, Janko
dc.contributor.authorCroes, Kristof
dc.contributor.authorWu, Chen
dc.contributor.authorSchaekers, Marc
dc.contributor.authorPeter, Antony
dc.contributor.authorKauerauf, Thomas
dc.contributor.authorTeugels, Lieve
dc.contributor.authorBoemmels, Juergen
dc.date.accessioned2021-10-22T01:13:36Z
dc.date.available2021-10-22T01:13:36Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23747
dc.sourceIIOimport
dc.titleContact module at dense gate pitch technology challenges
dc.typeProceedings paper
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorMao, Ming
dc.contributor.imecauthorVersluijs, Janko
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorWu, Chen
dc.contributor.imecauthorSchaekers, Marc
dc.contributor.imecauthorPeter, Antony
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecWu, Chen::0000-0002-4636-8842
dc.contributor.orcidimecSchaekers, Marc::0000-0002-1496-7816
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.source.peerreviewyes
dc.source.beginpage307
dc.source.endpage310
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate20/05/2014
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6831894
imec.availabilityPublished - imec


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