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Reflow process optimization for micro-bumps applications in 3D technology

dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorDe Preter, Inge
dc.contributor.authorEngland, Luke
dc.contributor.authorSchmid, Daniel
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorVakanas, George
dc.contributor.authorWang, Teng
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorLerch, Wilfried
dc.contributor.authorMiller, Andy
dc.date.accessioned2021-10-22T01:14:53Z
dc.date.available2021-10-22T01:14:53Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23753
dc.sourceIIOimport
dc.titleReflow process optimization for micro-bumps applications in 3D technology
dc.typeProceedings paper
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage5
dc.source.conference5th Electronics System-Integration Technology Conference - ESTC
dc.source.conferencedate16/09/2014
dc.source.conferencelocationHelsinki Finland
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6962837
imec.availabilityPublished - open access


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