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Semi-additive Cu-Polymer RDL process for interposers applications

dc.contributor.authorDuval, Fabrice
dc.contributor.authorDetalle, Mikael
dc.contributor.authorSun, Xiao
dc.contributor.authorBeyne, Eric
dc.contributor.authorRoda Neve, Cesar
dc.contributor.authorVelenis, Dimitrios
dc.date.accessioned2021-10-22T01:21:36Z
dc.date.available2021-10-22T01:21:36Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23785
dc.sourceIIOimport
dc.titleSemi-additive Cu-Polymer RDL process for interposers applications
dc.typeProceedings paper
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage6
dc.source.conferenceElectronics System-Integration Technology Conference - ESTC
dc.source.conferencedate16/09/2014
dc.source.conferencelocationHelsinki Finland
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6962789&contentType=Conference+Publications
imec.availabilityPublished - imec


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