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NiB Capping of Cu landing pads for thermocompression bonding

dc.contributor.authorEngland, Luke
dc.contributor.authorDictus, Dries
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorConard, Thierry
dc.contributor.authorDaily, Robert
dc.contributor.authorMarinissen, Erik Jan
dc.date.accessioned2021-10-22T01:23:26Z
dc.date.available2021-10-22T01:23:26Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23794
dc.sourceIIOimport
dc.titleNiB Capping of Cu landing pads for thermocompression bonding
dc.typeMeeting abstract
dc.contributor.imecauthorDictus, Dries
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecDictus, Dries::0000-0002-7896-1747
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewno
dc.source.conference23rd Materials for Advanced Metallization Conference
dc.source.conferencedate2/03/2014
dc.source.conferencelocationChemnitz Germany
imec.availabilityPublished - imec


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