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Picking large thinned dies with high topography on both sides

dc.contributor.authorGerets, Carine
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorWang, Teng
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorPodpod, Arnita
dc.contributor.authorDemeurisse, Caroline
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T01:37:25Z
dc.date.available2021-10-22T01:37:25Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23854
dc.sourceIIOimport
dc.titlePicking large thinned dies with high topography on both sides
dc.typeProceedings paper
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorDemeurisse, Caroline
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage175
dc.source.endpage1979
dc.source.conference16th IEEE Electronic Packaging Technology Conference - EPTC
dc.source.conferencedate3/12/2014
dc.source.conferencelocationMarina Bays Sands Singapore
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7028289
imec.availabilityPublished - open access


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