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Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias

dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorStruyf, Herbert
dc.contributor.authorTanaka, Tetsu
dc.date.accessioned2021-10-22T02:13:45Z
dc.date.available2021-10-22T02:13:45Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23985
dc.sourceIIOimport
dc.titleCu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias
dc.typeProceedings paper
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage4
dc.source.conferenceIEEE 3D System Integration Conference - 3DIC
dc.source.conferencedate1/12/2014
dc.source.conferencelocationKinsale Ireland
dc.identifier.urlhttps://ieeexplore.ieee.org/document/7152147
imec.availabilityPublished - open access


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