Authors

Inoue, Fumihiro; Philipsen, Harold; Van Huylenbroeck, Stefaan; van der Veen, Marleen; Armini, Silvia; Struyf, Herbert; Tanaka, Tetsu

Conference

IEEE International Interconnect Technology Conference / Advanced Metallization Conference - IITC/AMC

Title

Electroless Cu seed on Ru and Co liners in high aspect ratio TSV

Publication type

Proceedings paper