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CVD Mn-based barrier for advanced copper interconnect technology: integration study

dc.contributor.authorJourdan, Nicolas
dc.date.accessioned2021-10-22T02:24:21Z
dc.date.available2021-10-22T02:24:21Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24019
dc.sourceIIOimport
dc.titleCVD Mn-based barrier for advanced copper interconnect technology: integration study
dc.typeMeeting abstract
dc.contributor.imecauthorJourdan, Nicolas
dc.source.peerreviewno
dc.source.beginpageEM-Tu5
dc.source.conferenceAVS 61st International Symposium & Exhibition
dc.source.conferencedate9/11/2014
dc.source.conferencelocationBaltimore, MD USA
dc.identifier.urlhttp://www2.avs.org/symposium2014/Papers/Paper_EM-TuM5.html
imec.availabilityPublished - imec


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