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Chip-level interconnections realized via the laser-induced forward transfer technique

dc.contributor.authorKaur, Kamalpreet
dc.contributor.authorMissinne, Jeroen
dc.contributor.authorVan Steenberge, Geert
dc.date.accessioned2021-10-22T02:30:39Z
dc.date.available2021-10-22T02:30:39Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24038
dc.sourceIIOimport
dc.titleChip-level interconnections realized via the laser-induced forward transfer technique
dc.typeProceedings paper
dc.contributor.imecauthorKaur, Kamalpreet
dc.contributor.imecauthorMissinne, Jeroen
dc.contributor.imecauthorVan Steenberge, Geert
dc.contributor.orcidimecMissinne, Jeroen::0000-0002-3470-620X
dc.contributor.orcidimecVan Steenberge, Geert::0000-0001-8574-1235
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpageAF3B.4
dc.source.conferenceAsia Communications and Photonics Conference - ACP
dc.source.conferencedate11/11/2014
dc.source.conferencelocationShanghai China
dc.identifier.urlhttp://dx.doi.org/10.1364/ACPC.2014.AF3B.4
imec.availabilityPublished - open access


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