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Fluxless flip-chip bonding of single photodetector chips using laser-induced forward transfer

dc.contributor.authorKaur, Kamalpreet
dc.contributor.authorVan Steenberge, Geert
dc.date.accessioned2021-10-22T02:30:56Z
dc.date.available2021-10-22T02:30:56Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24039
dc.sourceIIOimport
dc.titleFluxless flip-chip bonding of single photodetector chips using laser-induced forward transfer
dc.typeProceedings paper
dc.contributor.imecauthorKaur, Kamalpreet
dc.contributor.imecauthorVan Steenberge, Geert
dc.contributor.orcidimecVan Steenberge, Geert::0000-0001-8574-1235
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpageIM3A.2
dc.source.conferenceIntegrated Photonics Research, Silicon and Nanophotonics
dc.source.conferencedate13/07/2014
dc.source.conferencelocationSan Diego, CA USA
dc.identifier.urlhttp://www.opticsinfobase.org/abstract.cfm?uri=IPRSN-2014-IM3A.2
imec.availabilityPublished - open access
imec.internalnotesthis paper was not presented at the conference


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