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Conference contributions
Flip-chip bonding of fine-pitch ultra-thin chips for SiF applications
Publication:
Flip-chip bonding of fine-pitch ultra-thin chips for SiF applications
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Date
2014
Proceedings Paper
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31334.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Kusters, Roel
;
Sridhar, Ashok
;
Cauwe, Maarten
;
van den Brand, Jeroen
Journal
Abstract
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1918
since deposited on 2021-10-22
Acq. date: 2025-12-12
Citations
Metrics
Views
1918
since deposited on 2021-10-22
Acq. date: 2025-12-12
Citations