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Reliability challenges for barrier/liner system in high aspect ratio through silicon vias

dc.contributor.authorLi, Yunlong
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorVan Besien, Els
dc.contributor.authorShi, Xiaoping
dc.contributor.authorWu, Chen
dc.contributor.authorStucchi, Michele
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorCroes, Kristof
dc.date.accessioned2021-10-22T03:04:01Z
dc.date.available2021-10-22T03:04:01Z
dc.date.issued2014
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24137
dc.sourceIIOimport
dc.titleReliability challenges for barrier/liner system in high aspect ratio through silicon vias
dc.typeJournal article
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorVan Besien, Els
dc.contributor.imecauthorWu, Chen
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecVan Besien, Els::0000-0002-5174-2229
dc.contributor.orcidimecWu, Chen::0000-0002-4636-8842
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewyes
dc.source.beginpage1949
dc.source.endpage1952
dc.source.journalMicroelectronics Reliability
dc.source.issue9_10
dc.source.volume54
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S002627141400273X
imec.availabilityPublished - imec
imec.internalnotesSpecial issue: 25th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - ESREF; Berlin


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