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Thermo-mechanical stress induced by CPI on 3D interposer package

dc.contributor.authorLofrano, Melina
dc.contributor.authorGonzalez, Mario
dc.date.accessioned2021-10-22T03:13:29Z
dc.date.available2021-10-22T03:13:29Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24161
dc.sourceIIOimport
dc.titleThermo-mechanical stress induced by CPI on 3D interposer package
dc.typeProceedings paper
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorGonzalez, Mario
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage5
dc.source.conference15th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE
dc.source.conferencedate7/04/2014
dc.source.conferencelocationGent Belgium
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6813821&contentType=Conference+Publications
imec.availabilityPublished - imec


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