Show simple item record

A multilevel sub-modeling approach to evaluate 3D IC packaging induced stress on hybrid interconnect structures

dc.contributor.authorLofrano, Melina
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVandevelde, Bart
dc.date.accessioned2021-10-22T03:13:48Z
dc.date.available2021-10-22T03:13:48Z
dc.date.issued2014
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24162
dc.sourceIIOimport
dc.titleA multilevel sub-modeling approach to evaluate 3D IC packaging induced stress on hybrid interconnect structures
dc.typeJournal article
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage85
dc.source.endpage89
dc.source.journalMicroelectronic Engineering
dc.source.volume120
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S016793171300693X
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
28938.pdf
Size:
1.576Mb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record