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Effect of processing parameters on self-assembly of cylindrical phase PS-b-PMMA BCPs on 300 mm Si wafers

dc.contributor.authorLoucif Seiad, Mohamed
dc.contributor.authorSingh, Arjun
dc.contributor.authorMKuppuswamy, Vijaya Kumar
dc.contributor.authorFerhat, Marhoun
dc.contributor.authorGronheid, Roel
dc.date.accessioned2021-10-22T03:16:46Z
dc.date.available2021-10-22T03:16:46Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24170
dc.sourceIIOimport
dc.titleEffect of processing parameters on self-assembly of cylindrical phase PS-b-PMMA BCPs on 300 mm Si wafers
dc.typeMeeting abstract
dc.contributor.imecauthorSingh, Arjun
dc.contributor.imecauthorGronheid, Roel
dc.source.peerreviewno
dc.source.beginpagena
dc.source.conference58th International Conference on Electron, Ion, and Photon Beam Technology and Nanofabrication - EIPBN
dc.source.conferencedate27/05/2014
dc.source.conferencelocationWashington DC USA
imec.availabilityPublished - imec


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