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Convolution based compact thermal model: methodology for including the thermal impact of die to die interconnections

dc.contributor.authorMaggioni, Federica
dc.contributor.authorOprins, Herman
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBaelmans, Tine
dc.date.accessioned2021-10-22T03:20:25Z
dc.date.available2021-10-22T03:20:25Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24178
dc.sourceIIOimport
dc.titleConvolution based compact thermal model: methodology for including the thermal impact of die to die interconnections
dc.typeProceedings paper
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage9115
dc.source.conference15th International Heat Transfer Conference - IHTC
dc.source.conferencedate10/08/2014
dc.source.conferencelocationKyoto Japan
imec.availabilityPublished - imec


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