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Convolution based compact thermal model application to the evaluation of the thermal impact of die-die interface including interconnections

dc.contributor.authorMaggioni, Federica
dc.contributor.authorOprins, Herman
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBaelmans, Tine
dc.date.accessioned2021-10-22T03:20:46Z
dc.date.available2021-10-22T03:20:46Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24179
dc.sourceIIOimport
dc.titleConvolution based compact thermal model application to the evaluation of the thermal impact of die-die interface including interconnections
dc.typeProceedings paper
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage98
dc.source.endpage106
dc.source.conferenceIEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - 14th IEEE ITHERM
dc.source.conferencedate27/05/2014
dc.source.conferencelocationLake Buena Vista USA
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6892270&contentType=Conference+Publications
imec.availabilityPublished - imec


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