dc.contributor.author | Maggioni, Federica | |
dc.contributor.author | Oprins, Herman | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | De Wolf, Ingrid | |
dc.contributor.author | Baelmans, Tine | |
dc.date.accessioned | 2021-10-22T03:20:46Z | |
dc.date.available | 2021-10-22T03:20:46Z | |
dc.date.issued | 2014 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/24179 | |
dc.source | IIOimport | |
dc.title | Convolution based compact thermal model application to the evaluation of the thermal impact of die-die interface including interconnections | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Oprins, Herman | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | De Wolf, Ingrid | |
dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 98 | |
dc.source.endpage | 106 | |
dc.source.conference | IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - 14th IEEE ITHERM | |
dc.source.conferencedate | 27/05/2014 | |
dc.source.conferencelocation | Lake Buena Vista USA | |
dc.identifier.url | http://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6892270&contentType=Conference+Publications | |
imec.availability | Published - imec | |