dc.contributor.author | Majeed, Bivragh | |
dc.contributor.author | Soussan, Philippe | |
dc.contributor.author | Le Boterf, P. | |
dc.contributor.author | Bouillon, P. | |
dc.date.accessioned | 2021-10-22T03:22:47Z | |
dc.date.available | 2021-10-22T03:22:47Z | |
dc.date.issued | 2014 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/24185 | |
dc.source | IIOimport | |
dc.title | Microbumping technology for hybrid IR detectors, 10 $lm pitch and beyond | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Majeed, Bivragh | |
dc.contributor.imecauthor | Soussan, Philippe | |
dc.contributor.orcidimec | Soussan, Philippe::0000-0002-1347-6978 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 453 | |
dc.source.endpage | 457 | |
dc.source.conference | IEEE 16th Electronics Packaging Technology Conference - EPTC | |
dc.source.conferencedate | 3/12/2014 | |
dc.source.conferencelocation | Singapore Singapore | |
dc.identifier.url | http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7028336 | |
imec.availability | Published - imec | |