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Design, test generation, processing, and pre- and post-bond measurement results of a 3D-DfT demonstrator chip stack

dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorDe Wachter, Bart
dc.contributor.authorO'Loughlin, Stephen
dc.contributor.authorDeutsch, Sergej
dc.contributor.authorPapameletis, Christos
dc.contributor.authorBurgherr, Tobias
dc.date.accessioned2021-10-22T03:29:12Z
dc.date.available2021-10-22T03:29:12Z
dc.date.issued2014-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24202
dc.sourceIIOimport
dc.titleDesign, test generation, processing, and pre- and post-bond measurement results of a 3D-DfT demonstrator chip stack
dc.typeProceedings paper
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.imecauthorDe Wachter, Bart
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewyes
dc.source.conferenceCDN Live! EMEA
dc.source.conferencedate19/05/2014
dc.source.conferencelocationMünchen Germany
imec.availabilityPublished - imec


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