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Photosensitive insulation coating for a copper redistribution layer process

dc.contributor.authorMatsutani, Hiroshi
dc.contributor.authorMitsukura, Kazuyuki
dc.contributor.authorMakino, Tatsuya
dc.contributor.authorDuval, Fabrice
dc.contributor.authorDetalle, Mikael
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T03:39:10Z
dc.date.available2021-10-22T03:39:10Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24229
dc.sourceIIOimport
dc.titlePhotosensitive insulation coating for a copper redistribution layer process
dc.typeProceedings paper
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.source.peerreviewyes
dc.source.beginpage111
dc.source.endpage113
dc.source.conferenceIEEE CPMT Symposium Japan "Packaging for Future Optoelectroni cs, RF/High-Speed Electronics and Bioelectronics"
dc.source.conferencedate4/11/2014
dc.source.conferencelocationKyoto Japan
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7009622
imec.availabilityPublished - imec


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