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CMP on SiGe materials - linking chemical and physical properties to design low defect selective slurries

dc.contributor.authorOng, Patrick
dc.contributor.authorSiebert, Max
dc.contributor.authorHuang, Kevin
dc.contributor.authorTeugels, Lieve
dc.contributor.authorAnsar, Sheik
dc.contributor.authorLeunissen, Peter
dc.date.accessioned2021-10-22T04:27:01Z
dc.date.available2021-10-22T04:27:01Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24344
dc.sourceIIOimport
dc.titleCMP on SiGe materials - linking chemical and physical properties to design low defect selective slurries
dc.typeMeeting abstract
dc.contributor.imecauthorOng, Patrick
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.orcidimecOng, Patrick::0000-0002-2072-292X
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.source.peerreviewno
dc.source.beginpagena
dc.source.conferenceInternational Conference on Planarization Technology - ICPT
dc.source.conferencedate19/11/2014
dc.source.conferencelocationKobe Japan
imec.availabilityPublished - imec


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