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Thermal aspects of 3D and 2.5D integration
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Authors
Oprins, Herman
;
Cherman, Vladimir
;
Van der Plas, Geert
;
Beyne, Eric
Conference
IMAPS-Benelux Winter Event 2014: Heat Management in Microelectronic systems
Title
Thermal aspects of 3D and 2.5D integration
Publication type
Oral presentation
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