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Degradation of Cu6Sn5 intermetallic compound by pore formation in solid-liquid interdiffusion Cu/Sn microbump interconnects

dc.contributor.authorPanchenko, Iuliana
dc.contributor.authorCroes, Kristof
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorBeyne, Eric
dc.contributor.authorWolter, Klaus-Juergen
dc.date.accessioned2021-10-22T04:34:13Z
dc.date.available2021-10-22T04:34:13Z
dc.date.issued2014
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24361
dc.sourceIIOimport
dc.titleDegradation of Cu6Sn5 intermetallic compound by pore formation in solid-liquid interdiffusion Cu/Sn microbump interconnects
dc.typeJournal article
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage26
dc.source.endpage34
dc.source.journalMicroelectronic Engineering
dc.source.volume117
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0167931713006916
imec.availabilityPublished - imec


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