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W2W permanent stacking for 3D system integration

dc.contributor.authorPeng, Lan
dc.contributor.authorKim, Soon-Wook
dc.contributor.authorSoules, Michael
dc.contributor.authorGabriel, Markus
dc.contributor.authorZoberbier, Margarete
dc.contributor.authorSleeckx, Erik
dc.contributor.authorStruyf, Herbert
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T04:39:55Z
dc.date.available2021-10-22T04:39:55Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24374
dc.sourceIIOimport
dc.titleW2W permanent stacking for 3D system integration
dc.typeProceedings paper
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorKim, Soon-Wook
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage4
dc.source.conference16th IEEE Electronic Packaging Technology Conference - EPTC
dc.source.conferencedate3/12/2014
dc.source.conferencelocationSingapore Singapore
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7028287
imec.availabilityPublished - open access


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