Authors

Priyabadini, Swarnakamal; Sterken, Tom; Cauwe, Maarten; Van Hoorebeke, Luc; Vanfleteren, Jan

ISSN

2156-3950

Issue

1

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volume

4

Title

High yield fabrication process for 3D-stacked ultra-thin chip packages using photo-definable polyimide and symmetry in packages

Publication type

Journal article

Embargo date

9999-12-31