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The potential for Cu-free ni plated contacts enabled by smart wire connection technology

dc.contributor.authorRussell, Richard
dc.contributor.authorTous, Loic
dc.contributor.authorUruena De Castro, Angel
dc.contributor.authorKuzma Filipek, Izabela
dc.contributor.authorHendrickx, Dirk
dc.contributor.authorDuerinckx, Filip
dc.contributor.authorSzlufcik, Jozef
dc.contributor.authorSoederstroem, Thomas
dc.contributor.authorYao, Yu
dc.contributor.authorBertens, Jurgen
dc.date.accessioned2021-10-22T05:22:36Z
dc.date.available2021-10-22T05:22:36Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24467
dc.sourceIIOimport
dc.titleThe potential for Cu-free ni plated contacts enabled by smart wire connection technology
dc.typeOral presentation
dc.contributor.imecauthorTous, Loic
dc.contributor.imecauthorKuzma Filipek, Izabela
dc.contributor.imecauthorHendrickx, Dirk
dc.contributor.imecauthorDuerinckx, Filip
dc.contributor.imecauthorSzlufcik, Jozef
dc.contributor.orcidimecTous, Loic::0000-0001-9928-7774
dc.contributor.orcidimecDuerinckx, Filip::0000-0003-2570-7371
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conference5th Workshop on Metallization of Crystalline Silicon Solar Cells
dc.source.conferencedate20/10/2014
dc.source.conferencelocationKonstanz Germany
imec.availabilityPublished - open access


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