Authors

Van Keymeulen, Bjorn; Gonzalez, Mario; Bossuyt, Frederick; De Baets, Johan; Vanfleteren, Jan

Conference

15th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE

Title

Mechanical analysis of encapsulated metal interconnects under transversal load

Publication type

Proceedings paper

Embargo date

9999-12-31