Show simple item record

Chip-package interaction in 3D stacked IC packages using finite element modelling

dc.contributor.authorVandevelde, Bart
dc.contributor.authorIvankovic, Andrej
dc.contributor.authorDebecker, Bjorn
dc.contributor.authorLofrano, Melina
dc.contributor.authorVanstreels, Kris
dc.contributor.authorGuo, Wei
dc.contributor.authorCherman, Vladimir
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-22T07:29:45Z
dc.date.available2021-10-22T07:29:45Z
dc.date.issued2014
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24729
dc.sourceIIOimport
dc.titleChip-package interaction in 3D stacked IC packages using finite element modelling
dc.typeJournal article
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorGuo, Wei
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1200
dc.source.endpage1205
dc.source.journalMicroelectronics Reliability
dc.source.issue6_7
dc.source.volume54
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0026271414000833
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record