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Ultra-thin chip package (UTCP) and elastic circuit technologies for compact or conformable sensor and electronics assemblies

dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2021-10-22T07:33:45Z
dc.date.available2021-10-22T07:33:45Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24737
dc.sourceIIOimport
dc.titleUltra-thin chip package (UTCP) and elastic circuit technologies for compact or conformable sensor and electronics assemblies
dc.typeMeeting abstract
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conference1st Conf. JSPS Core to Core Programme
dc.source.conferencedate18/06/2013
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - open access


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