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Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs

dc.contributor.authorWang, Teng
dc.contributor.authorDaily, Robert
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorGerets, Carine
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T08:10:11Z
dc.date.available2021-10-22T08:10:11Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24804
dc.sourceIIOimport
dc.titleDevelopment of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs
dc.typeProceedings paper
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage5
dc.source.conference5th Electronics System-Integration Technology Conference - ESTC
dc.source.conferencedate16/09/2014
dc.source.conferencelocationHelsinki Finlan
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6962710
imec.availabilityPublished - imec


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