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Development of B-spline x-ray diffraction imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips

dc.contributor.authorWong, C.S.
dc.contributor.authorIvankovic, Andrej
dc.contributor.authorCowley, A.
dc.contributor.authorBennett, N.S.
dc.contributor.authorDanilewsky, A.
dc.contributor.authorGonzalez, Mario
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVandevelde, Bart
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorMcNally, P.J.
dc.date.accessioned2021-10-22T08:23:28Z
dc.date.available2021-10-22T08:23:28Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24829
dc.sourceIIOimport
dc.titleDevelopment of B-spline x-ray diffraction imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips
dc.typeProceedings paper
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1517
dc.source.endpage1522
dc.source.conferenceIEEE 64th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate27/05/2014
dc.source.conferencelocationLake Buena Vista, FL USA
dc.identifier.urlhttp://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6897495&tag=1
imec.availabilityPublished - open access


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