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Stochastic modeling of polyethylene glycol as a suppressor in copper electroplating

dc.contributor.authorYang, Liu
dc.contributor.authorRadisic, Alex
dc.contributor.authorDeconinck, Johan
dc.contributor.authorVereecken, Philippe
dc.date.accessioned2021-10-22T08:40:57Z
dc.date.available2021-10-22T08:40:57Z
dc.date.issued2014
dc.identifier.issn0013-4651
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24860
dc.sourceIIOimport
dc.titleStochastic modeling of polyethylene glycol as a suppressor in copper electroplating
dc.typeJournal article
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpageD269
dc.source.endpageD276
dc.source.journalJournal of the Electrochemical Society
dc.source.issue5
dc.source.volume161
dc.identifier.urlhttp://jes.ecsdl.org/content/161/5/D269.full
imec.availabilityPublished - open access


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