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Metallization approaches and challenges for interconnect downscaling both from R and C perspective

dc.contributor.authorArmini, Silvia
dc.date.accessioned2021-10-22T18:30:36Z
dc.date.available2021-10-22T18:30:36Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24941
dc.sourceIIOimport
dc.titleMetallization approaches and challenges for interconnect downscaling both from R and C perspective
dc.typeMeeting abstract
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.source.peerreviewyes
dc.source.conferenceCSTIC Symposium IV: Thin Film Technology
dc.source.conferencedate15/03/2015
dc.source.conferencelocationShanghai China
imec.availabilityPublished - imec


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