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Surface planarization of Cu and CuNiSn micro-bumps embedded in polymer for below 20μm pitch 3DIC applications

dc.contributor.authorDe Preter, Inge
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorHeylen, Nancy
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T18:51:28Z
dc.date.available2021-10-22T18:51:28Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25146
dc.sourceIIOimport
dc.titleSurface planarization of Cu and CuNiSn micro-bumps embedded in polymer for below 20μm pitch 3DIC applications
dc.typeMeeting abstract
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.source.peerreviewno
dc.source.conference32nd Advanced Metallization Conference - AMC
dc.source.conferencedate18/05/2015
dc.source.conferencelocationAustin, TX USA
imec.availabilityPublished - imec


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